Products in this family provide increased convenience of access to the electrical contacts of a connector, integrated circuit, or similar device by providing interconnection between a component placement area (typically for a fine-pitch, surface mounted integrated circuit) and an interconnect area typically having a much larger distance between pin centers. A common application is accommodating the use of solderless breadboards as a prototyping method for components that are not available in breadboard-compatible packaging.
Proto Board Type: Indicates a device package style accommodated and the alternative packaging/mounting scheme to which the device is adapted.
Package Accepted: Indicates which specific device package, style, or type the adapter board can accept.
Number of Positions: How many different discrete contact points the device bears.
Pitch: Indicates the center-to-center spacing between adjacent pins.
Board Thickness: Indicates the nominal thickness of the circuit board material from which a product is constructed.
Material: Indicates the material composition of the device.
Size / Dimension: The physical dimensions of the device. Usually given in Length by Width, in Inches (Millimeters).
|MFR PART #||LCQT-SOIC8-8|
|DIGI-KEY PART #||A880AR-ND|
|DESCRIPTION||SOCKET ADAPTER SOIC TO 8DIP|
|MFR PART #||BOB-13655|
|DIGI-KEY PART #||1568-1123-ND|
|DESCRIPTION||SOIC TO DIP ADAPTER 8PIN 1=4 PCS|
|MFR PART #||PA0064C|
|DIGI-KEY PART #||315-PA0064C-ND|
|MANUFACTURER||Chip Quik Inc.|
|DESCRIPTION||QFN-24-THIN TO DIP-24 SMT ADAPTE|
|MFR PART #||1862|
|DIGI-KEY PART #||1528-2043-ND|
|MANUFACTURER||Adafruit Industries LLC|
|DESCRIPTION||JST-PH 2-PIN R/A BREAKOUT BOARD|