these MAX® 10 series of Field Programmable Gate Array (FPGA) IC’s with 130 I/O’s 193536 RAM Bits 4000 Logic Elements/Cells in 169-LFBGA from Altera (Ex-INTEL Programmable Solutions Group [PSG]) with an Operating Temperature of -40°C to +100°C (TJunction) are really difficult to get as DK# 544-3255-ND / 10M04SAU169I7G – very limited support for Distribution end customers.
The only drop-in alternatives from stock have all a reduced Consumer Grade Operating Temperature of 0°C to +85°C as:
10M04SAU169C8G described as IC FPGA 130 I/O 169UBGA.
10M16SAU169C8G could be another option with much less RAM Bits: 562176 or
10M08SAU169C8G with even much less RAM Bits: 387072
The comparable XCS40XL-4PQG208C as IC FPGA 169 I/O in 208QFP from AMD’s Spartan®-XL series (Ex-XILINX) is already obsolete.
The actual 10M02SCU169C8G as IC FPGA 130 I/O 169UBGA from Altera’s MAX® 10 series could also be an easy migration path.
The T120F324C3 as IC FPGA 130 I/O in 324FBGA from Efinix, Inc. Trion® series would be a different architecture that requires new tools and
the LCMXO3LF-1300C-5BG256I as IC FPGA 206 I/O 256CABGA from Lattice Semiconductor Corporation’s MachXO3 series has at least -40°C to +100°C as extended Operating Temperature range and
the AGL125V5-CSG196I as IC FPGA 133 I/O in 196CSP from Microchip Technology’s IGLOO series would also need hard- and firmware adoption.