------Question for XTR117AIDGKR Please Put your question below------
We are designing a PCB with this IC, and want to prepare the components list for it. With this component (XTR117), we see that the product has many types of packaging in the same list. How can i select the one i’m using in the design? is there any sustantial difference between the options(VSSOP-8, MSOP-8)? i see in their datasheet have a different gap between pins, and im worried about it.
Thanks for your answer.
The package type is designated from the suffix the DGK is VSSOP, 8 and the DRB is VSON, 8. This information is noted on page 1 of the datasheet.
Full package dimensions and board layout information can be found on pages 20~27 of the datasheet.
If your question is specifically about the reference on our website to what we are referring to as a “Package / Case” of “8-TSSOP, 8-MSOP”, we list both of these because they are both common terms for the exact same package. In the instance of this part, Texas Instruments also refers to it as a VSSOP package. All of these names refer to the exact same package. The dimensions are given in the datasheet and also shown below for your reference.
The XTR117AIDGKR refers to the “VSSOP” package with leads which extend out from the body, referred to as the “DGK008A” package outline in the datasheet.
From page 21:
The XTR117AIDRBR refers to the “SON” package (equivalent to what’s commonly referred to as a “DFN” package) with leads which do not extend out from the body and which includes a thermal pad which much be soldered underneath the component. This is referred to as the “DRB” package outline in the datasheet.
From page 25:
Both package types have a pin-pin spacing, referred to as “pitch”, of 0.65mm
