We are currently using MX29LV160DBTI-70G in our design and have reviewed PCN #P-2508-0025, which announced the discontinuation of SPIL assembly and the qualification of additional assembly manufacturing sites. The PCN indicated that follow-up PCNs would be released upon completion of the qualification activities for the new assembly locations.
As stated in PCN #P-2508-0025, the following assembly sites are under evaluation:
ChipMOS
OSE (Orient Semiconductor Electronics)
ASECL
LINGSEN
We request you to kindly share the follow-up PCNs related to the qualification of these assembly sites for MX29LV160DBTI-70G. Specifically, we would like to understand:
The qualification status of each of the above assembly sites.
1. Any follow-up PCNs issued for the site transfer or addition of these assembly locations.
2. The impact, if any, on device performance, reliability, electrical characteristics, quality, or product specifications due to the assembly site change.
3. Whether there are any changes to:
a. Die fabrication process or wafer fabrication site
b. Die material or die revision
c. Assembly materials (leadframe, mold compound, bonding wire, die attach material, etc.)
d. Package construction
e. Product form, fit, function, or reliability qualifications