This post addresses several frequently asked questions about Bosch Sensortec’s BMF055 part.
What are the differences between the BMF055 and the BNO055?
The BNO055 and BMF055 share the same hardware, both are System in Package (SiP) integrating:
- 3-axis accelerometer,
- 3-axis gyroscope
- 3-axis geomagnetic sensor
- 32-bit Cortex M0+ microcontroller
The difference is that BNO055 comes with BSX 3.0 sensor fusion software, therefore the sensor can provide fused sensor data output such as Quaternion, Rotation, Linear acceleration, Robust heading… While the BMF055 does not include the BSX 3.0 software, but it is freely programmable, and developers can customize and develop their software on the cortex M0+ MCU.
for more information on the sensors please refer to the following product pages:
Can ultrasonic cleaning and welding damage IMUs such as the BMF055?
Ultrasonic cleaning and welding may damage the MEMS sensors including the BMF055. Ultrasonic cleaning and welding processes are not recommended for Bosch Sensortec’s MEMS sensors. You could try using 40KHz or above ultrasonic cleaning and welding to see if the MEMS sensors are still working or not. But it is at your own risk.
Can the BNO055 shuttle board work on the BMF055 breakout board?
BNO055 shuttle board and BMF055 shuttle board have the same pinout, so you can directly use the BNO055 shuttle board on the breakout board.
Hardware side, they are compatible.
Software side, you need to run different SW since BMF055 has no fusion algorithm inside and BNO055 has.
All information was provided by Bosch Sensortec’s Forum.