Q1 - What is the shelf life of Molex connectors, and what conditions are necessary to maintain their solderability?
A - Unless otherwise specified, Molex solderable product should remain solderable as tested per EIA/IPC/JEDEC J-STD-002D (Category I) for a minimum period of 6 months from the shipping date on the product packaging. This is contingent upon the product staying in its original packaging and staying within a stable, pollutant-free environment. It is recommended that solderability be confirmed through testing at once before use. See chart below. The shelf life for the housing parts are typically 5 years as shown in the chart below:
Q2 - What are the recommended storage conditions for maintaining the quality of the parts?
A - Looking at the chart above, these values are based on standard storage conditions of 23°C and 50% relative humidity
Q3 - How is the general tolerance specified for parts, and where can it be found if not listed with dimensions?
A - The tolerance value is always specified in a SD (Specification Document). You can refer to general tolerance in SD if it is not specified with dimension. please see below.
Q4 - How does Molex address Moisture Sensitivity Levels (MSL) for its products, and what should customers consider during PCB assembly processes?
A - Electronic Assembly Industry Standards Committees IPC and JEDEC have addressed concerns over the vaporizing and out-gassing of these hygroscopic sensitive materials during PCB assembly in the two specifications listed below:
A - IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices”
B - IPC/JEDEC J-STD-033 “Handling, Packing, Shipping, and Use of Moisture/Reflow Sensitive Surface Mount Devices.”
Connectors were not included in the two industry specifications listed above. Molex has not evaluated, packaged, or labeled our products as needed per J-STD-020 and J-STD-033. However, Molex does understand that in some PCB assembly processes certain housing materials may show blistering due to absorbed moisture. Molex has taken steps to independently label some of our products as moisture-sensitive to warn customers that care should be taken when storing and using these products
PDF document, for MSL Statement to be sent to the customer here:
Q5 - How can I find the glow wire status for a specific part number?
A - The glow wire compliance status for a specific part number can be found on the product’s webpage. If the information is not available online or if further clarification is needed, please contact the Product Compliance team directly.
Example part number:900-0469920820-ND
Q6 - How long does it take to receive a VDE certificate?
A - VDE certificates are available upon request. Molex coordinates internally with its agency team to obtain these documents, which typically takes a few days. Please note that VDE certificates are issued for product series, not individual part numbers. Additionally, if a product is not glow-wire capable, a VDE certificate will not be available.
Q7 - Where can I find 3D models for Molex parts, and what steps should I take if the models are not available on the Molex website?
A - 3D models for Molex parts are typically available on the product’s webpage under the Engineering Documents section. If a model is not listed, Molex will coordinate with their internal Engineering team to provide it typically within 3 to 4 business days.
Please note: 3D models for terminal parts are not available for sharing, however, here is picture snap shot of a power connector:
Q8 - What are the differences between flammability ratings, and which UL standards do Molex connectors follow?
A - Flammability ratings for Molex parts can be found on the product webpage and in the Specification Document (SD). Molex connectors typically comply with UL 94 flammability standards, including V-0, V-1, and V-2 classifications.
UL 94 Vertical Burn Ratings Explained:
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V-0: Flame extinguishes within 10 seconds with no dripping of flaming particles.
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V-1: Flame extinguishes within 30 seconds with no dripping.
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V-2: Flame extinguishes within 10 seconds with dripping of flaming particles.
These ratings are determined by testing how long a vertically mounted polymer specimen (such as connector housing material) continues to burn and glow after being exposed to a flame. The test also evaluates whether flaming particles drip from the specimen.
Q9 - Where can I find the Comparative Tracking Index (CTI) for a specific part, and who should I contact for further details if it’s not listed?
A - CTI - value can be found on the UL Yellow Card for the material used in the part. If you need more information, you are welcome to contact the Molex team here:
Q10 - What is reflow capability and what does it mean? Which materials are used in Molex connectors that are suitable for reflow soldering processes?
A - Reflow capability refers to a material or component’s ability to endure the high temperatures typically around 260°C used during the reflow soldering process. Molex connectors made with resin materials such as Liquid Crystal Polymer (LCP). High-temperature thermoplastics are suitable for reflow soldering, provided the temperature guidelines are used.
Q11 - Can you mate Tin with Gold and or Tin with Silver?
A - Gold-to-tin contact mating is not recommended due to the increased reliability risks associated with combining these dissimilar metals. This pairing has not been tested to ensure consistent product performance and may lead to issues under conditions such as thermal cycling and vibration, can be shown here in this Molex blog.
Q12 - What is the difference between Surface Mount Technology (SMT) or Through Hole mounting?
A - Surface Mount Technology (SMT) and Through-Hole Technology (THT) are two distinct methods used to mount electronic components onto printed circuit boards (PCBs). SMT involves placing components directly onto the surface of the PCB, allowing for compact and automated assembly. In contrast, THT requires inserting component leads through holes in the PCB and soldering them on the opposite side, offering stronger mechanical bonds and suitability for high-stress environments.
See these pictures of SMT and Through-hole parts put onto a PCB.
Q13 - What is the difference between Bright Tin Plating and Matte Tin Plating?
A -Bright tin plating is known for its shiny, mirror-like finish, which gives it strong cosmetic appeal. This finish is achieved through acidic bath, typically sulfuric acid-based (which can make them appear shiny) and or combined with organic brighteners that refine the grain structure. However, bright tin deposits tend to have higher internal stresses and are more prone to whisker growth (which can look like little fingers). Additionally, the co-deposited organic compounds from the brighteners can interfere with soldering by burning off during the process, leading to poor solder wetting.
In contrast, matte tin plating has a dull, satin-like appearance due to its larger grain structure. It is produced using either acidic or alkaline baths without the use of brighteners. The absence of organic additives results in a more chemically stable coating with significantly lower internal stress and reduced whisker formation. Matte tin is generally preferred for applications requiring high solderability and long-term reliability.
Q14 - I want to find the Molex equivalent to a competitor part number. How would I find this out?
A - Here is a link to the Molex Cross reference
Q15 - When digging through Molex connector types, what do the status codes AT, LTB, D1, D2, E1, and E2 represent in Molex product lifecycle for availability, and how should they be interpreted for purchase?
A - AT - stands for Attrition. The parts with low volume and low demand are consolidated under ‘AT’ status in every periodical wave of Obsolescence. The parts under ‘AT’ sales status are meant to be supported only for existing customers who are already using it and not to be recommended for any New Business (New Business Not Supported – NBNS)
D1- Planned Obsolete with Replacement: Used when a fixed EOL date has been identified and the transition is underway. A planned replacement PN exists.
D2- Planned Obsolete without Replacement: Used when a fixed EOL date has been identified and the transition D2 is underway. A planned replacement PN DOES NOT exist.
E1- Obsolete With Replacement: Used when a fixed EOL date is identified and obsolescence is complete. A planned replacement PN exists.
E2- Obsolete Without Replacement: Used when a fixed EOL date is identified and obsolescence is complete. A planned replacement PN DOES NOT exist
This process is intended to ramp down the volume further before being announced as obsolete. LTB – Last Time Buy is the date that is set until when the parts under ‘AT” can be bought last.
Q16 - What is the lead time for Molex parts available or check with our Digi Key distributor for their lead times.
Q17 - What is meant by MM Loading, this is referring to whether or not a part number has not been extend to any of the sales regions.
You may want to contact Molex here. If the part number has not been extended to any of the sales regions. The Power team will coordinate internally to load the MM (Material Master) data in the appropriate region.
MM loading refers to entering basic connector information into CRM (Customer Relationship Management system), including details such as:
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DU (Distribution Unit)
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SPQ (Standard Pack Quantity)
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Connector weight
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Delivery plant
and other relevant attributes
Q18 - Why Molex is Not Allowing Current Sharing in Our Parts?
A - We recommend against using our connectors for current sharing due to the complexity and variability of application factors, such as crimp, PCB layout, wire type, and airflow. Connectors can be failure points in current sharing but are often not the root cause. A single pin rated for the full current is typically the best and most cost-effective solution.
Using TWO pins for current sharing, especially in uncontrolled environments, risks failure due to unequal current distribution. This issue is common across all connector brands. For best performance, adhere to recommended ratings and design practices.
Q19 - Can you explain what UL and other agency certification files refer to?
A - Molex connectors are certified to standards such as UL, IEC, and CSA, and the corresponding file numbers are typically available on the product webpage. If a customer requires official certification documents, Molex will coordinate internally with our agency team to obtain them. Please note that this process may take a few days to complete.
Q20 - Why Molex is Not Promoting the Intermating of Non-Molex Parts?
A - Molex does not promote intermating with non-Molex components because such combinations have not been evaluated or tested. As a result, we cannot guarantee how our parts will perform when mated with products from other manufacturers.
For example, when a Molex connector is paired with a Molex-certified mating part, the combination is assessed by UL, which provides a report including heat rise and current ratings. However, if a customer uses a mating part from another brand—such as TE or JST—this performance data is not available, and the reliability of the connection cannot be assured.
Additionally, even if a non-Molex part were tested with our connector, there is no way to ensure long-term consistency. Manufacturers may update or modify their designs without notice, and such changes could negatively impact performance.
For these reasons, we recommend using only Molex-certified mating components to ensure safety, reliability, and compliance with performance standards.
Q21 - What is an ‘AT’ Inclusion Table?
A - The ‘AT Inclusion Table’ lists parts that are scheduled for obsolescence. These decisions are made during each cycle of the periodic obsolescence review process.
Q22 - What are Application Tools, and what role do they play in the manufacturing assembly process?
A - This is Molex’s recommended tools for crimping, extraction, and insertion are detailed in the Application Tooling section of the website. Customers can select the appropriate tool based on the wire size and specific application requirements.
Q23 - What is USCAR Certification, and why is it important?
A - USCAR certification is required for automotive applications. Some Molex product families have been partially tested to meet USCAR-2 vibration standards, while others have undergone full testing. These details are specified in the product specifications (PS) document. However, Molex connectors are generally recommended for use in these areas of the vehicle that may experience lower levels of vibration.
Q24 - What is the Plating material and Thickness?
A - The plating material refers to the type of metal applied to the pins or terminals, while the thickness indicates the amount of that metal coating. This information can be found in the sales drawing document or inside the associated datasheet.
Q25 - How is the Protrusion length related to PCB thickness?
A - Protrusion length is calculated by reducing PCB thickness from the pin length that is the minimum length required to ensure proper soldering to avoid cold Joints.
Q26 - What is Yellow Card Material?
A - A Yellow Card is issued by the resin supplier once a polymeric material has successfully passed UL (Underwriters Laboratories) testing. It certifies that the material meets specific safety and performance standards. Yellow Card details are considered confidential and are only shared in a redacted format if the customer has a valid Non-Disclosure Agreement (NDA) in place.
Q27 - Where to find the Crimp specification information?
A - Carefully check the Molex Application Tooling specification. Crimp specification information can be found on molex.com by referring to the Application Tooling Specification (ATS) document. Additionally, please review the attached image below, which provides an example of how crimp specifications are presented in the table format.
Q28 - Where can I find the information on Molex Packaging?
A - Packaging information can be found on the product detail page at molex.com. Connectors may be packaged in various formats such as tubes, trays, bags, or tape and reel. The specific packaging type is listed both in the Sales Drawing (SD) and on the product webpage. Also, you can view more details on our site.
Q29 - What is meant by a PCN notice or What information is typically included in a PCN document?
A - Product Change Notification PCN, can show the changes that are made in a product. A PCN is generated for a notice that can be sent to a customer, once the PCN has been created.
Q30 - What is the durability of Molex connectors and where do we get this data?
A - Durability refers to the number of mating and unmuting cycles a connector can withstand. This value is primarily influenced by the type of plating used. Typically, tin-plated connectors support around 30 cycles, while gold-plated connectors can handle between 50 to 100 cycles, depending on the plating thickness and manufacturing conditions. Detailed durability specifications can be found in the product specification (PS) document and on Molex’s official website.
Q31 - Where can I obtain information about warranty and product lifetime for Molex products?
A - For any questions regarding warranty coverage or product lifetime, please post your questions in our Tech Forum. Otherwise, reach out to Digi Key Technical support.
Q32 - What is a salt spray test, and how do Molex connectors perform under these conditions?
A - salt spray test, also known as a salt fog test or salt corrosion test, is used to decide the corrosion resistance and durability of materials and coatings, especially in locations where they may be subjected to salt or salty conditions. This test is widely used in several industries.
Q33 - What is PCB potting, and how does it protect circuit boards?
A - PCB potting is a method of protecting circuit boards that involves filling a PCB enclosure with a liquid solution known as a potting compound or encapsulation resin (sometimes this potting can cover up exposed land patterns prior to soldering).
Q34 - What is wipe length and how is wipe length determined for connectors?
A - Wipe length refers to the distance that connector contacts slide against each other during mating. Removing surface contaminants like oxidation or dust from the contact area. Establishing a clean metal-to-metal interface for better conductivity. Enhancing durability by distributing wear over a longer contact path.
This sliding action serves several purposes:
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Cleans the contact surface by removing oxidation, dust, or other contaminants
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Creates a reliable metal-to-metal interface for improved conductivity
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Distributes wear across a longer contact path, enhancing durability
Wipe length is typically determined by subtracting the fully mated position from the reliable mating point, as outlined in connector design specifications.
Q35 - Can you explain what stack height is in the context of connectors, and where to find this specification?
A- Stack height is the total vertical distance between the bottom surface of the upper PCB and the top surface of the lower PCB when the connector is fully mated. This specification is typically listed in the supplier datasheet (SD).
Q36 - What are the key differences between POWER connectors and SIGNAL connectors?
Power Connectors:
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Primary Function: Deliver electrical power (high current) to devices or components.
Current Rating: High (often several amps or more).
Voltage Rating: Typically, higher than signal connectors.
Pin Size & Spacing: Larger pins and wider spacing to handle higher currents.
Contact Design: Optimized for low resistance and heat dissipation.
Applications: Power supplies, motors, battery connections.
Signal Connectors
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Primary Function: Transmit data or low-level electrical signals
Current Rating: Low (usually milliamps).
Voltage Rating: Lower than power connectors.
Pin Size & Spacing: Smaller pins, tighter pitch for high-density signals.
Contact Design: Optimized for signal integrity and minimal electrical noise.
Applications: Communication lines, sensors, control circuits.
Q37 - Can we send signal through power connector?
A - Yes, signals can be transmitted through power connectors in certain cases, depending on the connector type and overall system design. However, this approach may introduce challenges such as integrated power loss and potential signal integrity issues.
Q38 - What might be a PCIe connector, and what is the function?
A - PCIe (Peripheral Component Interconnect Express) connector is a high-speed interface used to connect various hardware components to a computer motherboard. It’s the go-to standard for linking devices like graphics cards, SSDs, Wi-Fi cards, and Ethernet adapters. We have options available with Micro-fit and Mini-fit families.
Q39 - What do MTBF and FIT stand for, and how can I obtain this data for Molex products?
A - MTBF (Mean Time Between Failures) is a reliability metric that estimates the average time between failures for a component or system, typically expressed in hours. FIT (Failures in Time) Is a representative number of failures expected rate per 109 hours per failure, or you may be able to review more details in the data sheet.
Q40 - How does potting protect PCB boards, and what materials are typically used in this process?
A -PCB potting is a protective process in which a liquid compound is poured into an enclosure containing the printed circuit board (PCB). Once cured, the compound forms a solid barrier around the components, shielding them from moisture, dust, vibration, chemicals, and electrical interference. This enhances the durability and reliability of the PCB, especially in harsh environments.
Q41 - What happens to a connector if a customer briefly exceeds its rated current, for a few milliseconds or nanoseconds?
A - Briefly exceeding the rated current per pin—such as for a few milliseconds or nanoseconds, may not cause immediate damage. However, if this occurs repeatedly, it can degrade connector performance over time and potentially lead to failure. Molex does not test connectors under these specific transient overload conditions, so we cannot guarantee performance or reliability in such scenarios. If customers wish to evaluate this, they are encouraged to conduct their own testing. That said, passing currents significantly above the rated value (or 5 times or more times) can cause immediate damage or burnout.