Sometimes, you may find an ‘e’ number on the packing label for your parts, such as ‘e0’. This ‘e’ number code aligns with the JEDEC standard J-STD-609, and often calls out what material is on the leads according to a JEDEC defined set of PB-free finish options.
JEDEC J-STD-609 is a standard to meet the needs of components manufacturers to provide a marking standard. It describes the lead free surface or terminal finishes and materials, and PB-free assembly solders. The following ‘e’ numbers codes are used:
- e0 - contains intentionally added lead (Pb)
- e1 - tin-silver-copper (SnAgCu) with silver content greater than 1.5% and no other intentionally added elements
- e2- tin (Sn) alloys with no bismuth (Bi) nor zinc (Zn), excluding tin-silver-copper (SnAgCu) alloys in e1 and e8
- e3 - tin (Sn)
- e4 - precious metal (e.g., silver (Ag), gold (Au), nickel-palladium (NiPd), nickel-palladium-gold (NiPdAu) (no tin (Sn))
- e5 - tin-zinc (SnZn), tin-zinc-other (SnZnX) (all other alloys containing tin (Sn) and zinc (Zn) and not containing bismuth (Bi))
- e6 - contains bismuth (Bi)
- e7 - low temperature solder (≤ 150 ºC) containing indium (In) [no bismuth (Bi)]
- e8 - tin-silver-copper (SnAgCu) with silver content less than or equal to 1.5%, with or without intentionally added alloying elements. This category does not include any alloys described by e1 and e2 or containing bismuth or zinc in any quantity.
- e9 - symbol - unassigned