Hello,
Any suggestions on how to decrease voiding on the GND pad?
Current voiding percentage 33%, looking to achieve less than 20%.
Stencil thickness 5mil with overprint
Hi fernandon,
Unfortunately, there is no single set of recommendations that work best, as there are a number of interdependent factors including type of solder, type of flux, stencil thickness, stencil pattern, thermal via quantity and pattern, plugged or unplugged vias, venting channel dimensions, among other factors.
There are a number of articles and papers on the subject one can find on the internet which might guide one to better results, depending on which type of solder you intend to use.
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