This Product Selection Guide contains information to help select products in the Solder Stencils, Templates category on DigiKey.com
Solder Stencils and Templates are a mask that is used to apply solder paste in a specific area on a PCB board. The stencil types are BGA, CSP, DFN, DFN/SON, FPC/FFC, HSOP, HTQFP, HTSSOP, LED, LED/DFN, LED/PLCC, LGA, LLP, LQFP, LSOP, mini SOIC, MLP/DFN, MLP/MLF, MQFP, MSOP, PLCC, PLCC/JLCC, POS, PowerQSOP, PowerSOIC, PowerSSO, PowerSSOP, PQFP, PSOP, QFN, QFN/LFCSP, QSOP, RN, RQFP, SOIC, SON, SOP, SOT/SC, SSOP, TO/DDPAK, TO/DPAK, TQFP, TSOC, TSOP, TSSOP, TVSOP, uMAX, VSOP, and VSSOP.
SelectionCharacteristics
Type: Describes the footprint type the time is designed to produce.
Number of Positions: Number of leads the footprint would have.
Pitch: Describes center to center spacing of elements of the footprint being produced.
Outer Dimension: Indicates overall dimensions of a stencil.
Inner Dimension: Indicates inner dimensions of a stencil.
Thermal Center Pad: For stencils having aperatures for under-chip thermal connections, indicates the outer dimensions of the thermal pad area.
Material: Indicates from what a device is fabricated.
ProductExamples
| MFR PART # | COMP-TOP-STENCIL-HELP-1 |
|---|---|
| DIGI-KEY PART # | 315-COMP-TOP-STENCIL-HELP-1-ND |
| MANUFACTURER | Chip Quik Inc. |
| DESCRIPTION | COMPACT SERIES ADAPTER TOP SIDE |
| DATASHEET | Click Here |
| MFR PART # | BGA0034-S |
|---|---|
| DIGI-KEY PART # | 315-BGA0034-S-ND |
| MANUFACTURER | Chip Quik Inc. |
| DESCRIPTION | BGA-676 (1.0 MM PITCH, 26 X 26 G |
| DATASHEET | Click Here |
| MFR PART # | PA0096-S |
|---|---|
| DIGI-KEY PART # | PA0096-S-ND |
| MANUFACTURER | Chip Quik Inc. |
| DESCRIPTION | STENCIL VQFP-64 .5MM |
| DATASHEET | Click Here |
| MFR PART # | IPC0006-S |
|---|---|
| DIGI-KEY PART # | IPC0006-S-ND |
| MANUFACTURER | Chip Quik Inc. |
| DESCRIPTION | QFN-16 STENCIL |
| DATASHEET | Click Here |
MediaLinks
Blogs
Prototyping with Solder Stencils - Another Teaching Moment | DigiKey