This Product Selection Guide contains information to help select products in the Solder category on DigiKey.com
Solder is Metal Alloys that are used to join metal surfaces to each other. The types are bar solder, ribbon solder, solder paste, solder shot, solder sphere, or wire solder in diameters ranging from 0.006” (0.15mm) to 0.250” (6.35mm) with melting point ranging from 244°F (118°C) to 1983°F (1084°C) in lead free or leaded. The flux type is acid cored, no-clean, rosin activated, rosin mildly activated, or water soluble.
SelectionCharacteristics
Type: Indicates the physical form of the product.
Composition: Indicates the material composition of the product.
Diameter: Indicates the diameter of the product.
Melting Point: The temperature at which the solid material will start to flow as a liquid.
Flux Type: Describes the formulation of the flux contained in the solder.
Wire Gauge: The gauge rating of the solder, typically expressed in terms of American Wire Gauge (AWG) and Standard Wire Gauge (SWG).
Mesh Type: For solder paste, this describes the size of the solder particles that are in the paste medium.
Process: Indicates whether a product is intended for use in lead-bearing or lead-free soldering processes.
Form: Indicates how the material is packaged and sold.
Shelf Life: Indicates the period of time for which material properties and performance are expected to remain within the manufacturer’s specifications, when stored and handled as indicated.
Shelf Life Start: Indicates the point from which the clock starts on the manufacturer’s specified shelf life.
Storage/Refrigeration Temperature: Indicates the temperature the product needs to be stored at to remain within manufacturer specifications. Improper storage temperature may reduce shelf life, alter the specifications, or damage or destroy the product.
ProductExamples
| MFR PART # | SMD2215-25000 |
|---|---|
| DIGI-KEY PART # | SMD2215-25000-ND |
| MANUFACTURER | Chip Quik Inc. |
| DESCRIPTION | Leaded Solder Sphere Sn63Pb37 (63/37) Jar |
| DATASHEET | Click Here |
| MFR PART # | EXB-SN63PB37-0.5LB |
|---|---|
| DIGI-KEY PART # | 315-EXB-SN63PB37-0.5LB-ND |
| MANUFACTURER | Chip Quik Inc. |
| DESCRIPTION | Leaded Bar Solder Sn63Pb37 (63/37) Bar, 0.5 lb (227g) |
| DATASHEET | Click Here |
| MFR PART # | 395439 |
|---|---|
| DIGI-KEY PART # | 82-142-ND |
| MANUFACTURER | Harimatec Inc. |
| DESCRIPTION | Leaded Rosin Activated (RA) Wire Solder Pb93.5Sn5Ag1.5 (93.5/5/1.5) 16 AWG, 18 SWG Spool, 17.64 oz (500g) |
| DATASHEET | Click Here |
| MFR PART # | 70-1607-0520 |
|---|---|
| DIGI-KEY PART # | KE1507-ND |
| MANUFACTURER | Kester Solder |
| DESCRIPTION | Leaded No-Clean Solder Paste Sn63Pb37 (63/37) Syringe, 1.23 oz (35g), 10cc |
| DATASHEET | Click Here |
MediaLinks
Articles
Different Types of Solder for Makers
How to Solder
Product Training Modules
Introduction to Solder Paste
Blogs
Solder and Flux