------Question for CS45-16IO1 Please Put your question below------
hOW TO MOUNT THIS PRODUCT ON HEAT SINK METAL PLATE MADE OF ALUMINIUM. sUGGEST A MOUNTING INSTRUCTIONS WITH SUITABLE THERMAL INTERFACE MATERIAL.
Hi @shreelekha.koteeswar ,
It is rather difficult to respond to your request without knowing more about your application.
Could you kindly elaborate:
- What is the expected average power loss by the thyristor?
- What is the thermal resistance of the aluminum plate?
- How high the ambient temperature can go?
Once it is possible to estimate the maximum allowed thermal resistance between the device case and the heat sink, a proper electrically isolating thermal bonding solution can be proposed.
: If you can electrically assign your heatsink, i.e. it is allowed to hover at the same voltage potential as the thyristor’s anode, you won’t need insulation → improved thermal coupling (consider a design, where the heatsink is a double-role metal slab, conducting both the thermal energy and the anode current!, while ensuring that the middle pin of the TO-247 device package is also connected to the same circuit for improved reliability.)
Cheers, heke
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