Request Component Information - SD101AWS - MCC

Semiconductor Discrete Semiconductor Products
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1

Hi, please help to advise the information for component below. Thanks.

MPN: SD101AWS
MFG: Micro Commercial Components

Please fill in the Tape & Reel details below

  1. Tape & Reel Carrier Tape Material : ( Embossed / Paper )
  2. Tape & Reel Carrier Tape Width :
  3. Tape & Reel Component Pitch :
  4. Component Pin 1 Location in Tape & Reel ( ° ) :

Please provide indications or markings for Pin 1.

MSL Level ( Moisture Sensitivity Level ) :

Component Washability ( Washable ) : ( Yes/No )

We only use Deionized Water via Aqueous Machine with Drying process after washing.

2

Hello zh_kuek

The below information can be found between two documents from Micro Commerical Co.
SD101AWS-SD101CWS Datasheet
SOD-323 Package Information

Tape & Reel Carrier Tape Material: Embossed
Tape & Reel Carrier Tape Width: 8.0mm +/- 0.3mm
Tape & Reel Component Pitch: 4.0mm +/- 0.1mm
Component Pin 1 Location in Tape & Reel: Reference page 2 of SOD-323 Package Information
MSL Level: MSL 1
Component Washability: I am going to have to reach out to our product specialist to see if they can provide this information. We will update you when we have received an answer.

3

Hello zh_kuek,

We received the following update from the manufacturer:

When washing MCC products on printed circuit boards to remove flux/ dirt with water, make sure that no reactive ions such as sodium or chlorine remain particularly. Some organic solvents react with water to generate hydrogen chloride and other corrosive gases which can result in semiconductor-product deterioration.

Please ensure no contaminants cleaning solution (flux-derived halogen, etc.) that were dissolved during cleaning, can result in semiconductor-product deterioration.

Dip cleaning, shower cleaning and steam cleaning processes are performed based on the chemical action of a solvent. Washing should be performed at your own discretion, utilizing information from detergent manufacturers. However, it is strongly recommended to bake the PCB at 120 degrees Celsius (<5% RH) for 2 hours after the cleaning process.

Avoid using ultrasonic cleaning with semiconductor products in hermetically sealed ceramic packages such as a leadless chip carrier (LCC), product module, pin grid array (PGA) or charge-coupled device (CCD). Using ultrasonic cleaning may cause the internal wires to become disconnected due to resonance. The basic recommended conditions are as follows:

Recommended Ultrasonic Cleaning Conditions
• Frequency:27 to 29 kHz
• Ultrasonic output: 15 W/L or less
• Cleaning time: 30 seconds or less