Thank you for your comment!
Regarding the lower inductance it is absolutely clear. It is not only about high speed interfaces, but also about EMI of DC/DC converters indeed. The one thing is not clear for me, normally to reach the same solder joint area I have to make a copper pad bigger in case of SMD pad design. How it may help me to reduce an inductance?
I’m using pads of 0.23mm for uBGAs im my design and in fact NSMD works for me better due to significantly less printing issues like low deposition and bad gasketing. LGAs are even more painful than BGAs. The mask has a thickness it causes worse wetting of the pad during the printing process and worse self-positioning during reflow just because a quite small package when the mask thickness becomes comparable with a stencil thickness.
Please comment.
Thank you,
Alex