Many of our customers have inquired about the gold (Au) plating thickness for TFE322P32K7680R, from CTS Corporation.
According to CTS Corporation, the following are the details regarding the device’s solder termination pads:
TFE322P32K7680R Crystal follows JEDEC standard e4, and its solder terminations are coated with a layer of nickel (Ni), which acts as a barrier, followed by a very thin layer of gold (Au), known as a “flash plate.”
Plating Process: Electro Immersion
Base Material: Tungsten (W)
Barrier Plating Material: Nickel (Ni)
Finish Plating Material: Gold (Au)
Thickness Specifications:
- Tungsten (W): 10-15 µm
- Nickel (Ni): 1.27-8.89 µm
- Gold (Au): 0.3-1.0 µm
Applicable part numbers
| Digikey Part Number | Manufacturer PartNumber |
|---|---|
| CTX1458TR-ND,CTX1458CT-ND,CTX1458DKR-ND | TFE322T32K7680R |
| CTX1457TR-ND,CTX1457CT-ND,CTX1457DKR-ND | TFE322P32K7680R |
| TFE322V32K7680R-ND | TFE322V32K7680R |
| 110-TFE321P32K7680R-ND | TFE321P32K7680R |
| 110-TFE321T32K7680R-ND | TFE321T32K7680R |
| 110-TFE321J32K7680R-ND | TFE321J32K7680R |