Asking for LED baking specification

[zz1234]

Hi,

I would like to know the baking specification (Baking temperature and baking duration) for the following component.
SFH 4726S
XPEBWT-L1-0000-00DZ5

[Brit_3226]

Hello and welcome to the Forum. This part is MSL 1 and does not have any baking requirements. Please see these other Forum posts that may be helpful.

Explaining MSL (Moisture Sensitivity Levels) - Support / Tech Tips - Engineering and Component Solution Forum - TechForum │ Digi-Key (digikey.com)

Humidity Cards and General Baking Rules

Humidity Indicator Cards indicate excessive moisture with a visible color change from blue to pink. When the packing bag is open, this card can be examined for proper dryness inside a bag. If there is a color change, baking might be required prior to the reflow process in order to remove any moisture out of the plastic package. For the baking condition, it depends on the packing thickness, MSL level and your baking temperature. [image] [image] [image] See also: Humidity Indicator Cards ht…

IPC JEDEC J-STD-033B Dry Packaging

Digi-Key is second-to-none in the industry when it comes to handling components. Packaging is priority when regarding your moisture (and static) sensitive devices. Moisture from atmospheric humidity enters permeable packaging materials by diffusion. Assembly processes used to solder SMD packages to printed circuit boards (PCBs) expose the entire package body to temperatures higher than 200°C. During solder reflow, the combination of rapid moisture expansion, materials mismatch, and material int…

[zz1234]

Hi,

I saw a parameter in the baking spec table of IPC/JEDEC J-STD-033B called package body. I would like to know if it counts including the thickness of the packaging and the component or just the component physical body size only.

[rick_1976]

I believe the reference is to the dimensions of the component itself.