Hello,
If component BME280 sensor pressure humidity device has been exposed to liquid during the clean process, can this component be re-baked?
Welcome to the Technical Forum. Can you provide the liquid that this was exposed to, and for how long?
The part in question is Moisture Sensitivity Level 1, baking again would not present a problem.
The component was exposed to an in-line wash system only using distilled water, wash time about 20min.
Thanks, my doubt is that the component has already been reflowed and the issue occurred during the cleaning process. Also, the datasheet does say this… " Liquids shall not come into direct contact with the device"
2. Do not perform dry-baking under “after solder reflow only”
Ah, I understand now.
The part is MSL 1, it shouldn’t need to be baked but I didn’t see the part in the datasheet indicating not to expose this unit to liquids. This would be a part you would want to install after a cleaning process.
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