IPC JEDEC J-STD-033B Dry Packaging

Digi-Key is second-to-none in the industry when it comes to handling components. Packaging is priority when regarding your moisture (and static) sensitive devices.

Moisture from atmospheric humidity enters permeable packaging materials by diffusion. Assembly processes used to solder SMD packages to printed circuit boards (PCBs) expose the entire package body to temperatures higher than 200°C. During solder reflow, the combination of rapid moisture expansion, materials mismatch, and material interface degradation can result in package cracking and/or delamination of critical interfaces within the package.

Proper storage and handling techniques are necessary to avoid moisture/reflow related failures. Please see below snippet of Digi-Key’s JEDEC J-STD-033B Dry Packing standard, you will notice the (MSL) Level, and its corresponding dry package requirements. For further Digi-Key JEDEC information regarding handling, packing, shipping and use of moisture/reflow sensitive surface mount devices, please see https://www.digikey.com/en/pdf/s/scs/scs-jedec-jstd033b-standards.

3.1 Requirements Dry packing requirements for the various moisture sensitivity levels are shown in Table 3-1. The levels are determined per J-STD-020 and/or per JESD22-A113 plus reliability testing. As a minimum all materials used in dry packing should conform to EIA-541.

Note: Level 6 has a mandantory bake before use, and must be reflowed within time limit specified on the label.

MBB= Moisture Barrier Bag
HIC= Humidity Indicator Card
MSID= Moisture Sensitive Identification (Label)

See also:
Explaining Moisture Sensitivity Levels:
Digi-Key Packaging and Protection:
Vacuum Sealed Packages:
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Gel Packs, Moisture Packs, and Jelly Packs: