How do we connect The exposed backside of the package or the ground terminal of the device? What type of welding should I use? What metal should be used as a support base (Cu or Al)?
Thanks
Hello,
Thank you for your post.
Based on the instructions within the datasheet the backside of the package would require a pad built-in to the board like on page 6. BLM2425M9S20.fm (ampleon.com)
For soldering it really comes down to preference and making sure to not overheat or burn the component.
Hi dinaelgi,
Here’s a document from Ampleon, AN11183: Mounting and soldering of RF transistors in overmolded plastic packages, which should help.
Here is an example of a cross-sectional view of how they would recommend one mount such a package:
FYI: “P” in the image above refers to a “solder preform”, which is a solid flat pre-formed piece of solder designed for controlled thickness and shaped for a specific application. Companies such as Ametek and Indium are examples of companies who can produce these.
Thanks., But the Heatsink is Cu or Al, What type of welding should I use for the Flange solder?
As per AN11183 document linked above, reflow soldering is the recommended process for attaching both the leads and the heatspreader.
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