Question:
If a MOSFET relay and PCB relay will be mounted on a PCB by flow soldering, can the same conditions as PCB relays be applied?
Answer:
The conditions are different from those for relays for PCB. Perform soldering based on the flow soldering in the Explanation.
Explanation:
Flow soldering conditions
The soldering conditions are as follows:
MOS FET relay
- Preheating: 150°C max., 60 to 120 seconds
- Soldering temperature: 260°C, within 10 seconds
- If the recommended conditions are exceeded, the performance of the semiconductor used may deteriorate due to heat.
Perform flow soldering within the recommended conditions.
PCB relay
- Preheating: 110°C max., within 40 seconds
- Soldering temperature: 260°C, within 5 seconds
- Since the temperature and time required for PCB relay soldering are lower than those for MOS FET relay soldering, check the solderability of both relays under PCB relay conditions.
- Flow soldering can be done only once.
For more information, see Common Precautions for All MOS FET Relays: Solder Mounting
For more information, see Safety Precautions for All Relays: 6-10 Automatic Mounting of Relays for PCBs.
Quick tips
Since the flow soldering is guaranteed only once, it is recommended to check the solderability before mass production.
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