------Question for LT8624SAV
I am looking for information on the junction to board thermal resistance of this component. Documentation available does not supply any resistance values.
Thanks.
------Question for LT8624SAV
I am looking for information on the junction to board thermal resistance of this component. Documentation available does not supply any resistance values.
Thanks.
Hello jmcnab, welcome to the TechForum! I’m not entirely certain on this, but I don’t think there is going to be a well defined junction to case thermal resistance stated in this instance. I think it highly depends on what the board design is. I am inferring this from their eval board documentation, click here. I can try to find out if there is a formula for this or if it’s dependent on the board design around it, if you’d like.
Hi Kaleb,
Correct that it depends on the board, however there are standardized JEDEC test boards commonly used for determining the Rjb (resistance junction to board) values.
Junction to case resistances (Rjc) shouldn’t depend on the board, as those are usually measured for die-up components. This is less useful for my application but would also be appreciated to level set package internals.
Thanks, John
Apparently, I missed this detail on the datasheet. Analog informed me that the info is on page 7. It’s called “JEDEC Board” on line 2 beneath the package.