Materials designed to provide thermal transfer between components and the heat sink to which they are attached. They are made from various materials and thicknesses which determines their thermal conductivity and/or resistivity. They can come with an adhesive on one or both sides to aid in maintaining contact with the surface to which they are applied.
Usage: The typical expected usage for which the pad was designed.
Type: Indicates the style and configuration of the pad.
Shape: Indicates the overall shape of the pad.
Outline: Indicates the dimensions for the outline of the pad.
Thickness: Indicates the overall thickness of the pad.
Material: Indicates the material composition of the pad.
Adhesive: Indicates if a product has strong or weak adhesive qualities, and the presence of such on one or both sides of the material.
Backing, Carrier: Indicates the material composition of the carrier of the pad.
Color: The dominant color of the device.
Thermal Resistivity: Characterizes heat transfer resistance of a thermal interface using a part or material under manufacturer-defined test conditions, which are typically chosen to be representative of an expected application.
Thermal Conductivity: Characterizes a material’s thermal energy transfer properties; typically measured using a standard method such as ASTM D5470.
|MFR PART #||SPK4-0.006-00-58|
|DIGI-KEY PART #||BER220-ND|
|DESCRIPTION||THERM PAD 19.05MMX12.7MM GRAY|
|MFR PART #||CP33-TO247-28.5-17.5-5.8-0.45|
|DIGI-KEY PART #||1168-CP33-TO247-28.5-17.5-5.8-0.45-ND|
|DESCRIPTION||THERM PAD 28.5X17.5X5.8MM GRAY|
|MFR PART #||EYG-S091207|
|DIGI-KEY PART #||P13688-ND|
|MANUFACTURER||Panasonic Electronic Components|
|DESCRIPTION||THERM PAD 115MMX90MM GRAY|
Product Training Modules
Installation Procedures for Thermal Management Materials