Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.
Type: Indicates the specific type or nature of the product.
Size/Dimension: Indicates the amount of a product received.
Usable Temperature Range: Recommended temperature as indicated by the manufacturer, typically given in a range or as a maximum. Exceeding these temperatures may affect performance or damage the product and other system components.
Color: The dominant color of the product.
Thermal Conductivity: Characterizes a material’s thermal energy transfer properties; typically measured using a standard method such as ASTM D5470.
Features: These are different capabilities or properties of the product such as odorless.
Shelf Life: Indicates the period of time for which material properties and performance are expected to remain within the manufacturer’s specifications, when stored and handled as indicated.
Storage/Refrigeration Temperature: The recommended temperature range to store the item to maintain its shelf-life expectancy.
|MFR PART #||PK223DM-110|
|DIGI-KEY PART #||3153-PK223DM-110-ND|
|MANUFACTURER||Shiu Li Technology Co., Ltd.|
|DESCRIPTION||TWO-PART THERMAL LIQUID GAP FILL|
|MFR PART #||8329TCS-6ML|
|DIGI-KEY PART #||473-1221-ND|
|DESCRIPTION||ADHESIVE - THERMAL CONDUCTIVE EP|
|MFR PART #||832TC-450ML|
|DIGI-KEY PART #||473-1089-ND|
|DESCRIPTION||THERMALLY CONDUCTIVE EPOXY|