Preventing Potting Compound Seepage: The Right D-Sub for a Clean Seal

We occasionally receive questions about how to prevent potting compound from seeping through the back of D-sub connectors, as it’s a critical concern for maintaining a clean, reliable, and functional assembly. A common misconception is that all D-subs will inherently prevent this, but the truth lies in specifying the right type of connector.

Recently, a customer inquired about what parameter keyword to search by to find D-sub connectors that won’t allow potting compound to seep through the back. Our recommendation? Look for IP-rated D-sub connectors, specifically those sealed for dust.

Why IP-Rated and Dust-Sealed?

  • Dust Sealing (the “6” in IP6x): The first digit in an IP rating refers to protection against solid objects. A “6” signifies complete protection against dust ingress. This level of sealing is crucial because it indicates a tight fit and barrier around the pins and within the connector body, which directly translates to preventing potting compound from seeping out.
  • Liquid Sealing (the second digit): While primarily for water, the liquid sealing aspect (e.g., “7” for immersion up to 1 meter, “8” for continuous immersion) further reinforces the integrity of the connector’s seal. If it can keep water out, it can certainly keep potting compound in.

This snippet is from the D-Sub Connector Assemblies category to show the IP ratings we currently have at this time.