Hello DigiKey TechForum Team,
I am currently designing a PCB using the TDK part number TPX322690MT-7017C1.
I have reviewed the public datasheet, but it only provides the recommended PCB land pattern. I could not find the recommended solder paste stencil design.
Could you please help me obtain the following information from TDK?
- Recommended stencil thickness
- Recommended solder paste aperture dimensions
- Whether the stencil aperture should be 1:1 with the PCB land pattern
- Recommended aperture reduction ratio, if required
- Recommended solder mask opening
- Full delivery specification, mounting guideline, or SMT assembly document for this part
If this information is not publicly available, could you please escalate the request to the TDK FAE or product engineering team?
Part number: TPX322690MT-7017C1
Manufacturer: TDK Corporation
Thank you for your support.