Surface Mount pad standoff identification

Semiconductor Discrete Semiconductor Products
1

Need help in identifying the component seen in the photos. It is used to elevate a surface mount pad above the surface of the substrate, as seen in the photos, about 0.5mm and it is 2mm square. It is mounted to the surface and connects to the top pad by means of a via through the center. This is for a solder point for a wire that needs to be elevated above the heat sink for this LED array board.

PXL_20211021_151102794
PXL_20211021_1511027941920×2560 252 KB

PXL_20211021_151239441
PXL_20211021_1512394411920×2560 230 KB

PXL_20211021_145227526
PXL_20211021_1452275261920×1440 104 KB

Thanks!
Josh

2

Hello Josh,

Thank you for posting on our TechForum. I am not sure as to exactly which product that is, but click here to view the category with those products. You can use the filters to find the one that works best for you.

3

Hi Brock,

Thank you for your reply.
This is not a bumper of any kind, it is actually a solder point that is extended off of the PCB substrate. It is surface mounted to the board and has another surface mount pad on the top and gives you an additional 0.5mm of height above the substrate to solder to. There is an internal via that connects the two sides.

Thanks!
Josh

4

I’ve never seen anything like this before. The part appears to be just a tiny piece of double sided PCB material consisting of a single square pad with a plated through hole. If that’s what it is, almost any PCB designer could draw it up, the catch would be finding a PCB fabricator willing to fabricate a panel of them.

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