Thermal Interface Materials in different device footprints


Thermal Interface Materials are one possible solution to enhance the heat transfer between a heat-generating part and heat dissipation devices. It is usually an afterthought to design, but the right thermal interface material can improve your device’s life time. So how do you select the right thermal interface material for different sizes of device and device footprints?


  • With a large device fooprint, a gap filler or putty is preferred so that all voids and surface irregularities are filled.

  • When the surface is particularly rough such that it can be highly compressed without generating significant pressure on the device, a putty can be used.

  • For smalled device footprints, a grease or PCM (Phase Change Material) is often more economical.