Products within the diode and rectifier array family incorporate two or more discrete diodes within a single package. They are characterized in terms similar to those used for single discrete diodes, with the addition of a “Diode Configuration” attribute indicating the presence and character of any internal connections between the diodes in the device. Note that arrays with a full-bridge configuration are specifically excluded and listed as a separate product family.
Diode Configuration: Indicates the number of diodes in the array and the internal connections between them.
Technology: Indicates which among several common diode construction methods a device employs. Has categorical influence on operating characteristics such as leakage current, recovery time, forward voltage, etc.
Voltage - DC Reverse (Vr) (Max): The maximum voltage that a device is rated to withstand in a reverse-biased or “blocking” mode. Exceeding this voltage may damage the device or other system components.
Current - Average Rectified (Io) (per Diode): Indicates the maximum allowable time-averaged current flow for any given diode within the device. May require de-rating depending on thermal conditions.
Voltage - Forward (Vf) (Max) @ If: Characterizes the voltage drop across a forward-biased diode, measured at the test current indicated.
Speed: Indicates the recovery time or lack thereof.
Reverse Recovery Time (trr): The amount of time required for a diode to transition from a forward-conducting to a reverse-blocking state, during which time current may flow through the device in the reverse direction. Measured under manufacturer-defined test conditions.
Current - Reverse Leakage @ Vr: Characterizes current flow through a diode-based device resulting from application of a reverse-bias voltage of the indicated magnitude, under manufacturer-defined test conditions. Observed values vary with temperature.
Operating Temperature - Junction: Indicates a device’s maximum rated operating temperature range, as measured at the electrically active portion of the device.
Mounting Type: Indicates how the device is attached.
Package / Case: Indicates the type of protective case used on an electronic component to allow easy handling, installation, and protection. This selection was determined to be the closest industry standard applicable to the supplier device packaging. Typically it is best to check the actual dimensions from the datasheet rather than depend on this terminology when designing your circuit.
Supplier Device Package: This is what the manufacturer calls the package of this device. They are manufacturer specific. It is typically best to use the actual dimensions from the datasheets rather than to go by this terminology when designing your circuit.
|MFR PART #||BAV99-7-F|
|DIGI-KEY PART #||BAV99-FDITR-ND - Tape & Reel (TR)|
|DESCRIPTION||Diode Array 1 Pair Series Connection 75 V 300mA (DC) Surface Mount TO-236-3, SC-59, SOT-23-3|
|MFR PART #||SDURF3030CT|
|DIGI-KEY PART #||SDURF3030CTSMC-ND|
|MANUFACTURER||SMC Diode Solutions|
|DESCRIPTION||Diode Array 1 Pair Common Cathode 300 V 15A Through Hole TO-220-3 Full Pack, Isolated Tab|
|MFR PART #||APT2X31S20J|
|DIGI-KEY PART #||APT2X31S20J-ND|
|DESCRIPTION||Diode Array 2 Independent 200 V 45A Chassis Mount SOT-227-4, miniBLOC|
|MFR PART #||2952198|
|DIGI-KEY PART #||2952198-ND|
|DESCRIPTION||Diode Array 4 Common Cathode 1000 V DIN Rail Module|