If you are looking for the baking conditions for IS25WP064 series memory from ISSI, Integrated Silicon Solution Inc., we have some useful information to share.
For example, part number IS25WP064A-JBLE is the 8-SOIC package.
ISSI recommends following JEDEC J-STD-033 as below:
- Tray packaging: Bake 8 hrs@125˚C
- Tape and Reel packaging: Bake 8 days@40˚C
Applicable Part numbers
706-1590-ND
IS25WP064A-JBLE-TR-ND
706-IS25WP064D-JBLE-TR-ND
706-IS25WP064D-JBLE-ND
706-IS25WP064D-JBLA3-TR-ND
706-IS25WP064D-JBLA3-ND
706-1442-ND
IS25WP064-JBLE-TR-ND
IS25WP064A-JBLE
IS25WP064A-JBLE-TR
IS25WP064D-JBLE-TR
IS25WP064D-JBLE
IS25WP064D-JBLA3-TR
IS25WP064D-JBLA3
IS25WP064-JBLE
IS25WP064-JBLE-TR