Micron FBGA Soldering Profile

Micron FBGA Soldering Profile

Reference Manual containing process-flow guidelines for Micron’s ball grid array packages.


Note: “Because the package landscape changes rapidly and information can become outdated very
quickly, refer to the latest product specifications”

Overview of a typical Ball Grid Array Package

Reflow Process Guidelines
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Please also see details regarding Micron Moisture Sensitivity for Plastic Packages