Hi DGK team,
Seeking your help to advise Reflow Profile Recommendation.
Dear customer,
as this standard PMIC is specified with a Moisture Sensitivity level of TWO, the Reflow
Sensitivity Classification for Nonhermetic Surface Mount Devices should be valid and the IPC-JEDEC-J-STD-020E superseding the IPC-JEDEC-J-STD-020C reflow soldering standard can be applied.
Bitte, Danke und Gruß zurück / Cordiali Saluti / Saludos Cordiales / Bien Cordialement,
Pozdrawiam / Med vänliga hälsningar / Met vriendelijke groeten / With Best Regards,
Rolf
P.S.: Be safe. Stay healthy. Help others. Continue learning. Build something amazing …. 
Rolf Horn
Applications Engineer
European Technical Support
DIGI-KEY ELECTRONICS GERMANY GMBH
Hi weizhe,
Here is a document relating to that package type which you might find useful:
SupIRBuck™ MCM Power Quad Flat No-lead (PQFN) Board Mount Application Note
For the part you are inquiring on, on the manufacturer’s product page, kindly see Infineon’s link for the manufacturer’s package type:
Provides the following link:
The information you’re looking for would be under > Board Assembly Recommendations.
The manufacturer also has a helpful application note on assembly/rework instructions found here:
https://www.infineon.com/dgdl/Infineon-SupIRBuck_MCM_Power_Quad_Flat_No-Lead_Inspection-AN-v01_00-EN.pdf?fileId=5546d462533600a401535599d07910b6Infineon-Board_Assembly_Recommendations-Integrated_Leadless-Package-v02_00-EN.pdf (1.1 MB)