Regarding: OPA137
As a PCB designer, I was burned by TI’s use of the WRONG name for the 0.65mm-pitch IC package. It cost me a Design Revision and some gratuitous adrenaline.
TI’s own website provides the original Burr-Brown spec sheet, which calls out MSOP-8 by name. Mouser/DigiKey have the “new” i.e. “VSSOP-8” package nomenclature, which I expect to be 0.5mm pitch 3.2mm tip-to-tip.
Q1 - WHAT happened? Q2 - is JEDEC a thing or what?
Answer Q1 - If you check JEDEC, MO-187, it specifies in the title that this is the spec for “0.65 AND 0.50 Pitch”. I have linked TI’s package page below, the JEDEC spec that covers the VSSOP package, and TI’s package drawing for VSSOP (DGK) that corresponds to the OPA2137 2 channel version of OPA137, (TI OPA137)
Answer Q2 -
Document packaging link from TI’s site, from JEDEC to PDF version.
My PCB footprint library has footprint “MSOP” as your VSSOP “DGK” describes, and footprint “VSSOP” per your VSSOP “DCU” drawing. As in SN74LVC2T45.
The STEP models the customer used in the PCB layouts are clearly labeled as such on my new board layout in conjunction with the JEDEC spec standard.
To know more about this part topic which reveals the JEDEC spec from TI
(see the PDF link above)
Original TI Forum Post:
OPA137: MSOP-8 or VSSOP-8? - Amplifiers forum - Amplifiers - TI E2E support forums