SMD Component Terminal Lift During Reflow Process

An inquiry Digi-Key recently received concerns SMT component soldering and an issue that arose during the process. The component’s terminal lifted during the reflow process. The below illustration demonstrates one of the conditions for the terminal lift.


After sharing the issue to the manufacturers, the below suggestions are what Digi-Key received.

  • The pre-heat of the reflow process was not high enough in temperature.
  • More soldering volume may help to prevent the problems.
  • Review the board’s solder pads