Thermal Management ICs are semiconductor device that controls the power in a circuit based on temperature. The functions of these ICs are Fan Control, Hardware Monitor, Temp Monitoring System, Thermal Monitor, Thermocouple Amplifier, Thermocouple Conditioner, and a Thermometer – Thermostat. The sensing temperature is from -260°C to +1800°C with an output type of I2C, SMBus, Active low/Active High, Analog Voltage, Open Drain, PWM, SPI, 2-Wire Serial, and Parallel – Serial.
Function: Indicates the primary functionality of the device.
Sensor Type: Indicates which style of sensor the device is designed to utilize.
Sensing Temperature: The temperature range the device is capable of detecting.
Accuracy: How closely measured temperature corresponds to actual temperature.
Topology: The internal circuit configuration of the device, determining characteristics of its behavior and functionality.
Output Type: The communication protocol the device uses to transmit its information to the host system it’s part of.
Output Alarm: Indicates the presence of an output that signals when the sensed temperature has exceeded some threshold.
Output Fan: Indicates the presence of an output intended for controlling the speed of an external fan.
Voltage - Supply: Typically represented by a range, this indicates the low and high voltage limits that one can expect in standard operation. Voltages outside this range may damage the device and other system components.
Operating Temperature: Recommended operating temperature, typically given in a range or as a maximum. Exceeding these temperatures may affect performance or damage the device and other system components.
Mounting Type: Indicates how the device is attached.
Package / Case: Indicates the type of protective case used on an electronic component to allow easy handling, installation, and protection. This selection was determined to be the closest industry standard applicable to the supplier device packaging. Typically it is best to check the actual dimensions from the datasheet rather than depend on this terminology when designing your circuit.
Supplier Device Package: This is what the manufacturer calls the package of this device. They are manufacturer specific. It is typically best to use the actual dimensions from the datasheets rather than to go by this terminology when designing your circuit.
|MFR PART #||MCP9844T-BE/MNY|
|DIGI-KEY PART #||MCP9844T-BE/MNYTR-ND - Tape & Reel (TR)|
|DESCRIPTION||Temp Monitoring System (Sensor) -40°C ~ 125°C Internal Sensor 2-Wire Serial, I²C Output 8-TDFN (2x3)|
|MFR PART #||MAX6684ESA+T|
|DIGI-KEY PART #||MAX6684ESA+TTR-ND - Tape & Reel (TR)|
|MANUFACTURER||Analog Devices Inc./Maxim Integrated|
|DESCRIPTION||Fan Control, Temp Monitor Internal Sensor Active Low/Open Drain Output 8-SOIC|
|MFR PART #||LM96080CIMT/NOPB|
|DIGI-KEY PART #||LM96080CIM/NOPB-ND|
|DESCRIPTION||Hardware Monitor -40°C ~ 125°C, External Sensor Internal and External Sensor 2-Wire Serial, I²C Output 24-TSSOP|
|MFR PART #||ADT7462ACPZ-REEL|
|DIGI-KEY PART #||ADT7462ACPZ-REELOSTR-ND - Tape & Reel (TR)|
|DESCRIPTION||Fan Control, Temp Monitor -40°C ~ 125°C, External Sensor Internal and External Sensor SMBus Output 32-LFCSP-VQ (5x5)|