Excessive PCB bending.
Bending gives tensile stress. Recommended to use soft termination.
Excessive change in nozzle suction.
Incorrect Z axis on pick and place or debris on PCB.
Excessive or significant differential in solder amount between pads.
Excessive temperature gradient in solder profile, excessive or incorrect solder used.
Difference in thermal expansion coefficient between chip and PCB.
Cyclic thermal stress, incorrect preheat settings.
Over Voltage Stress
High voltage resulting in short circuit. Pulse withstanding resistors should be used as these are designed for over-voltage pulses.
Thermal Shock in Wave Soldering
Cracks on Molded Powder Inductors
MLCC common failure issue (Flex Cracking)
Cracking issue on Vishay WSL series Resistors
Samsung Soft Termination MLCC