Bending
Excessive PCB bending.
Bending gives tensile stress. Recommended to use soft termination.
Nozzle
Excessive change in nozzle suction.
Incorrect (excessive) Z axis on pick and place or debris on PCB.
Over Solder
Excessive or significant differential in solder amount between pads.
Thermal
Excessive temperature gradient in solder profile, excessive or incorrect solder used.
Temp Cycle
Difference in thermal expansion coefficient between chip and PCB.
Cyclic thermal stress, incorrect preheat settings.
Over Voltage Stress
High voltage resulting in short circuit. Pulse withstanding resistors should be used as these are designed for over-voltage pulses.
See also:
Thermal Shock in Wave Soldering
Cracks on Molded Powder Inductors
MLCC common failure issue (Flex Cracking)
Cracking issue on Vishay WSL series Resistors
Samsung Soft Termination MLCC
Lead-Free Solder Complications
Easily Remove Solder Joints: SMD Removal / Desoldering Solder - What is Removal Alloy?
Tin Whiskers in Pure Tin Surface
Nickel Advantages in Tin-Plated Terminals: Surface Contact, Soldering, & Tin Whisker Growth
How To Ready a Solder Pot for Lead-Free Solder