Mill-Max offers receptacles and pass-through sockets that include an Organic Fibre Plug® (OFP®) barrier at one end. This feature, also known as a ‘knockout bottom’, prevents solder, flux, or paste from entering the receptacle cavity and contaminating the contact surface during PCB placement and soldering.
Question: Given that Mill-Max OFP® products are available in tape/reel packing, are they compatible with automated pick-and-place procedures?
Answer: Yes, the OFP® feature creates a barrier at the bottom end of the cylinder, and this allows a pick-and-place vacuum head to pick up the piece from the top end which faces outward on the tape packing.
Note the statement, “The OFP® barrier permits the sockets to be vacuum picked from the tape prior to placement in a hole in the circuit board.” on the following Mill-Max page regarding SOLDER BARRIER PIN RECEPTACLES & SOCKETS WITH OFP® KNOCKOUT BOTTOM .
On the same page, there is an Application Note link to more details regarding the Assembly Sequence for Intrusive Reflow Soldering for OFP® Receptacles.
The two photos, below, show the basic sequence for using pick-and-place vacuum heads with Organic Fibre Plug® receptacles and sockets.
For direct retrieval of the previous Mill-Max application note, use this file: Application Note - Assembly Sequence for Intrusive Reflow Soldering for OFP Receptacles.pdf (733.5 KB)
Relevant Manufacturer Product Codes on the Digi-key Site (at the post date of this article).
#OFP #OrganicFibrePlug #OrganicFiberPlug #Mill-Max #MillMax