PolarFire SoC Silicon Rollout

PolarFire SoC Silicon Rollout

Features MPFS025T MPFS095T MPFS160T MPFS250T-FCVG484EES MPFS460T-
FCG1152IPP
FPGA Fabric K Logic Elements (4LUT + DFF) 23 93 161 254 461
Math Blocks (18x18 MACC) 68 292 498 784 1420
LSRAM Blocks (20k bit) 84 308 520 812 1460
uSRAM Blocks (64x12) 204 876 1494 2352 4260
Total RAM Mbits 1.8 6.7 11.3 17.6 31.6
uPROM Kbits 194 387 415 470 553
User DLL’s/PLL’s 8 each 8 each 8 each 8 each 8 each
High Speed IO 250 Mbps to 12.5 Gbps SERDES Lanes 4 4 8 16 20
PCIe Gen2 End Points/Root Ports 2 2 2 2 2
Total FPGA IO HSIO+GPIO 108 276 312 372 468
Total MSS IO MSS IO 136 136 136 136 136
MSS DDR DB MSS DDR Data Bus 16 1 / 32 16 1 / 32 32 32 32
Packaging Type/Size/Pitch Initial Production Dates
FCSG325 (11x11, 0.5 mm) Now 1 Now 2
FCSG536 (16x16, 0.5 mm) Now Nov-22 Now
FCVG484 (19x19, 0.8 mm) Now Now Nov-22 Now
FCVG784 (23x23, 0.8 mm) Now Dec-22 Now
FCG1152 (35x35, 1.0 mm) Now Jun 2023 / Dec 2023

PolarFire™ SoC – System on Chip Pre Production / Production
Microchip Technology / Ex-Microsemi
Extended Commercial and Industrial Temperature Grades

1 16b DDR bus in FCSG325 package
2 FCSG325 package dimension for MPFS095T (11x14.5, 0.5mm)