PolarFire SoC Silicon Rollout
Features | MPFS025T | MPFS095T | MPFS160T | MPFS250T-FCVG484EES | MPFS460T- FCG1152IPP |
|
---|---|---|---|---|---|---|
FPGA Fabric | K Logic Elements (4LUT + DFF) | 23 | 93 | 161 | 254 | 461 |
Math Blocks (18x18 MACC) | 68 | 292 | 498 | 784 | 1420 | |
LSRAM Blocks (20k bit) | 84 | 308 | 520 | 812 | 1460 | |
uSRAM Blocks (64x12) | 204 | 876 | 1494 | 2352 | 4260 | |
Total RAM Mbits | 1.8 | 6.7 | 11.3 | 17.6 | 31.6 | |
uPROM Kbits | 194 | 387 | 415 | 470 | 553 | |
User DLL’s/PLL’s | 8 each | 8 each | 8 each | 8 each | 8 each | |
High Speed IO | 250 Mbps to 12.5 Gbps SERDES Lanes | 4 | 4 | 8 | 16 | 20 |
PCIe Gen2 End Points/Root Ports | 2 | 2 | 2 | 2 | 2 | |
Total FPGA IO | HSIO+GPIO | 108 | 276 | 312 | 372 | 468 |
Total MSS IO | MSS IO | 136 | 136 | 136 | 136 | 136 |
MSS DDR DB | MSS DDR Data Bus | 16 1 / 32 | 16 1 / 32 | 32 | 32 | 32 |
Packaging | Type/Size/Pitch | Initial Production Dates | ||||
FCSG325 (11x11, 0.5 mm) | Now 1 | Now 2 | ||||
FCSG536 (16x16, 0.5 mm) | Now | Nov-22 | Now | |||
FCVG484 (19x19, 0.8 mm) | Now | Now | Nov-22 | Now | ||
FCVG784 (23x23, 0.8 mm) | Now | Dec-22 | Now | |||
FCG1152 (35x35, 1.0 mm) | Now | Jun 2023 / Dec 2023 |
PolarFire™ SoC – System on Chip Pre Production / Production
Microchip Technology / Ex-Microsemi
Extended Commercial and Industrial Temperature Grades
1 16b DDR bus in FCSG325 package
2 FCSG325 package dimension for MPFS095T (11x14.5, 0.5mm)