I’d like to get a more complete explanation of electronic component packaging sizing/standards. If you could direct me to any of Digi’s resource documentation that gives a more complete description (and maybe even a little brief history) of all the different packaging types, full acronym wording i.e. TSOP, TSSOP, QFN, etc., capacitor/resistor/inductor sizing, why a particular package type is chosen for a device, and maybe even a little bit of description of the particular assembly techniques that would normally be used for a package type… (my knowledge/experience is just your basic soldering with a soldering iron or perhaps using an oven with solder paste. Beyond this, I wouldn’t have any idea how a late model smart phone might be soldered/assembled at the factory. It would be nice to have a more complete picture of the techniques used for the various package types).
Sorry for the long wind, but I hope you get the idea of the level of understanding I’m looking for. Digi may not have documentation that goes into this much detail, but whatever you could suggest would be greatly appreciated. Perhaps even a book recommendation (if such a book exists?) would be even a better source?
Thank you.