System On Chip (SoC)

This Product Selection Guide contains information to help select products in the System On Chip (SoC) category on DigiKey.com

Devices in the System-on-Chip family combine on one device substrate several computing system components which traditionally would be implemented as separate devices, such as a general-purpose microprocessor, an FPGA co-processor, and a graphics controller for generation of display data. While limited amounts of data storage resources may also be incorporated, the provision of an interface to external storage devices is typical.


SelectionCharacteristics

Architecture: Indicates functional blocks that are incorporated into a device.

Core Processor: Identifies the microprocessor or processor technology that serves as the primary computational engine for a board or device.

Flash Size: Amount of non-volatile memory available in the SoC.

RAM Size: Amount of RAM (Random Access Memory) available in the SoC.

Peripherals: Enumerates common functions that are incorporated within a device or specifically provisioned for by a device’s architecture.

Connectivity: Enumerates the standardized communication protocols for which a device provides hardware support.

Speed: Indicate the clock frequency of the device. This directly influences the overall rate computations that can be done in the device.

Primary Attributes: Provides a brief description of the programmable logic core incorporated in a device.

Operating Temperature: Recommended operating temperature, typically given in a range or as a maximum. Exceeding these temperatures may affect performance or damage the device and other system components.

Package / Case: Indicates the type of protective case used on an electronic component to allow easy handling, installation, and protection. This selection was determined to be the closest industry standard applicable to the supplier device packaging. Typically it is best to check the actual dimensions from the datasheet rather than depend on this terminology when designing your circuit.

Supplier Device Package: This is what the manufacturer calls the package of this device. They are manufacturer specific. It is typically best to use the actual dimensions from the datasheets rather than to go by this terminology when designing your circuit.

ProductExamples

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MFR PART # SC-20100S-A
DIGI-KEY PART # 1711-SC-20100S-A-ND
MANUFACTURER GHI Electronics, LLC
DESCRIPTION ARM Cortex-M7 System On Chip (SOC) IC - 480MHz 100-LQFP (14x14)
DATASHEET Click Here

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MFR PART # A2F200M3F-FGG256I
DIGI-KEY PART # 1100-1233-ND
MANUFACTURER Microchip Technology
DESCRIPTION ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops 80MHz 256-FPBGA (17x17)
DATASHEET Click Here

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MFR PART # XCZU1CG-2UBVA494I
DIGI-KEY PART # 122-XCZU1CG-2UBVA494I-ND
MANUFACTURER AMD
DESCRIPTION Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 81K+ Logic Cells 533MHz, 1.333GHz 494-FCBGA (14x14)
DATASHEET Click Here

MediaLinks

Videos
Microchips PolarFire® SoC FPGAs | First Look

Articles
How to use FPGA SoCs for Secure and Connected Hard Real-Time Systems

Product Training Modules
Video/Audio System on Chip (SOC) Codec Modules

If you have any general questions on the specifications for selecting System On Chip (SoC), please reply using the button below. If you have questions on specific System On Chip (SoC) please post those questions in the Integrated Circuits (ICs) category.