Laser Driver power management integrated circuits (PMICs) provide one or more controlled current sources for supplying semiconductor laser devices from a nominally constant-voltage power source. Commonly including a feature to enable feedback derived from the monitoring of the optical power emitted by the driven laser device, they are widely used in optical communications systems. They are differentiated from devices that perform a similar function by a capacity for high-frequency modulation of the current supplied to the powered device.
Type: Defines the primary construction style of the device, indicating which type of part it is and determining its general usage.
Data Rate: Indicates the maximum communication speed of the device.
Number of Channels: Indicates the number of independent output circuits available in the device.
Voltage - Supply: Typically represented by a range, this indicates the low and high voltage limits that one can expect in standard operation. Voltages outside this range may damage the device and other system components.
Current - Supply: This represents the maximum current to which a device will meet its given specifications. Exceeding this current may damage the device and/or other system components.
Current - Modulation: Maximum drive current modulation amplitude for which the device can be configured.
Current - Bias: Maximum steady-state output current for which the driver can be configured.
Operating Temperature: Recommended operating temperature, typically given in a range or as a maximum. Exceeding these temperatures may affect performance or damage the device and other system components.
Mounting Type: Indicates how the device is attached.
Package / Case: Indicates the type of protective case used on an electronic component to allow easy handling, installation, and protection. This selection was determined to be the closest industry standard applicable to the supplier’s device packaging. Typically it is best to check the actual dimensions from the datasheet rather than depend on this terminology when designing your circuit.
Supplier Device Package: This is what the manufacturer calls the package of this device. They are manufacturer-specific. It is typically best to use the actual dimensions from the datasheets rather than use this terminology when designing your circuit.
|MFR PART #||EPC21701|
|DIGI-KEY PART #||917-EPC21701TR-ND - Tape & Reel (TR)|
|DESCRIPTION||Laser Driver IC 1 Channel 80V|
|MFR PART #||MAX3738ETG+T|
|DIGI-KEY PART #||MAX3738ETG+TR-ND - Tape & Reel (TR)|
|MANUFACTURER||Analog Devices Inc./Maxim Integrated|
|DESCRIPTION||Laser Driver IC 4.25Gbps 1 Channel 2.97V ~ 3.63V 24-TQFN (4x4)|
|MFR PART #||SY88822VKG|
|DIGI-KEY PART #||576-2070-5-ND|
|DESCRIPTION||Laser Driver IC 155Mbps 1 Channel 3V ~ 3.6V, 4.5V ~ 5.5V 10-MSOP|
|MFR PART #||ISL58315CRTZ-T7|
|DIGI-KEY PART #||ISL58315CRTZ-T7-ND - Tape & Reel (TR)|
|MANUFACTURER||Renesas Electronics America Inc|
|DESCRIPTION||Laser Driver IC 300MHz 3 Channel 3.3V 40-TQFN (5x5)|
Fiber Optics for Radios