The Choice of Assembly Materials for mSiC™ – Silicon Carbide from Microchip
Temperature Coefficients of Expansion (TCEs) with more closely matched materials increase the module’s lifetime by reducing the stress at both the interface and interior of the materials. The higher the thermal conductivity, the lower the junction-to-case thermal resistance and the lower the delta of junction temperature of the device during operation. This will minimize the effect of power cycling on the dice.
Another important feature is the material density, particularly for the baseplate. Taking copper as the reference, AlSiC has a density of 1/3, while CuW has twice the density. Therefore, AlSiC will provide substantial weight reduction while increasing reliability.
Conclusion
The diverse applications of mSiC modules across industries such as electric vehicles, aerospace, and renewable energy systems underscore the transformative impact of SiC technology in power electronics. The shift towards SiC modules from traditional
silicon is not just a trend but a strategic response to the increasing demands for higher efficiency, greater power density and improved reliability in high-power applications. Customization of SiC modules further enhances their appeal, allowing for tailored solutions that maximize performance and durability to meet the specific needs of each application.
As industries continue to recognize the unmatched benefits of SiC technology, we can expect a continued rise in its adoption, driving innovation and sustainability in power systems worldwide. The future of power electronics is here and it is intrinsically linked to the capabilities and advancements offered by mSiC modules.
SiC-Modules-Enable-Diverse-Applications-from-Electric-Vehicles-to-Aerospace-and-Defense-00005690.pdf (2.9 MB)