This Product Selection Guide contains information to help select products in the FPGAs (Field Programmable Gate Array) with Microcontrollers category on DigiKey.com
Field Programmable Gate Arrays (FPGAs) are integrated circuit devices based on a matrix of configurable logic blocks (CLBs) that can be linked together via programmable interconnects to create digital circuits. These systems may range from simple Boolean functions or state machines to complete processor systems. In contrast to ASICs, FPGAs can be reprogrammed with new applications and functionality after manufacturing. Core types include 8-bit AVR and 32-bit ARM9.
SelectionCharacteristics
Core Type: Describes the processor core incorporated within a device, in terms of data word width and trade name.
Speed: Indicate the clock frequency of the device. This directly influences the overall rate computations that can be done in the device.
Interface: Indication of which interface(s) or protocol(s) are used by the device to communicate with other components in the system.
Program SRAM Bytes: Indicates the amount of program SRAM with which a device is equipped given as bytes.
FPGA SRAM: Indicates the amount of SRAM available in the FPGA portion of a device.
EEPROM Size: Describes the size of the non-volatile memory element integrated in a device for purposes of configuration and program storage.
Data SRAM Bytes: Indicates the amount of data SRAM with which a device is equipped given as bytes. Used during the running of the program to store data for computation.
FPGA Core Cells: Indicates the number of logic cells available in the FPGA portion of a device.
FPGA Gates: Indicates the number of logic gates present in the FPGA portion of a device.
FPGA Registers: Indicates the number of data storage registers present in the FPGA portion of a device.
Voltage - Supply: Typically represented by a range, this indicates the low and high voltage limits that one can expect in standard operation. Voltages outside this range may damage the device and other system components.
Mounting Type: Indicates how the device is attached.
Operating Temperature: Recommended operating temperature, typically given in a range or as a maximum. Exceeding these temperatures may affect performance or damage the device and other system components.
Package / Case: Indicates the type of protective case used on an electronic component to allow easy handling, installation, and protection. This selection was determined to be the closest industry standard applicable to the supplier device packaging. Typically it is best to check the actual dimensions from the datasheet rather than depend on this terminology when designing your circuit.
Supplier Device Package: This is what the manufacturer calls the package of this device. They are manufacturer specific. It is typically best to use the actual dimensions from the datasheets rather than to go by this terminology when designing your circuit.
ProductExamples
| MFR PART # | EOS3FLF512-WRN42 |
|---|---|
| DIGI-KEY PART # | 3857-EOS3FLF512-WRN42TR-ND - Tape & Reel (TR) |
| MANUFACTURER | QuickLogic |
| DESCRIPTION | EOS S3 ULTRA LOW POWER SENSOR & |
| DATASHEET | Click Here |
| MFR PART # | AT94K40AL-25BQU |
|---|---|
| DIGI-KEY PART # | AT94K40AL-25BQU-ND |
| MANUFACTURER | Microchip Technology |
| DESCRIPTION | IC FPSLIC 40K GATE 25MHZ 144LQFP |
| DATASHEET | Click Here |
MediaLinks
Articles
Get Embedded Microprocessor/FPGA Combo Designs Up and Running Fast with SoMs